DIGITAL-JU-CHIPS-2025-SG-SSOI
Call text (as on F&T portal)
View on F&T portalExpected Impact
Create a sustainable accelerator open to all European stakeholders, providing access to state-of-the-art sSOI technology and manufacturing capabilities.
• Develop and standardize Process Design Kits based on validated sSOI substrate data, enabling designers to optimise their system-level architectures and meet the demands of next generation applications. These PDKs should support the transition to 7nm FD-SOI technology, ensuring readiness for high-volume manufacturing by 2030.
• Expand the capabilities of sSOI substrates to industrial-scale wafer production, ensuring low defect densities and improved manufacturing yields that meet the rigorous standards of advanced semiconductor fabrication.
• Drive the creation of intellectual property and strengthen Europe's production capacity in sSOI technologies, contributing to Europe's leadership in critical semiconductor markets.
• With a particular focus on complementarity with the FD-SOI pilot line, foster collaborative development through synergies with other Chips JU pilot lines, enhancing the overall innovation capacity and technological leadership of Europe in semiconductor technologies,
• Provide comprehensive training programs and skill development initiatives to equip European technologists and engineers with the expertise necessary for sSOI substrate integration and advanced semiconductor manufacturing
Scope:The proposed accelerator should address all levels of the key technological steps required to bring sSOI substrates to industrial scale:
• Development of industrial-grade sSOI substrates will focus on achieving low defect density, crucial for enhancing electron mobility and ensuring high-performance FD-SOI devices at the 7 nm node. This will involve refining strain engineering techniques, particularly to introduce a uniform global strain that can balance the performance for strained NMOS and relaxed PMOS transistors.
• Ensure compatibility with existing semiconductor manufacturing, the accelerator will refine process integration and optimisation. This includes improving epitaxial growth, wafer bonding, and defect reduction techniques to meet the requirements of advanced FD-SOI production processes.
Finally, the accelerator will promote collaboration across the semiconductor ecosystem, working with other pilot lines, as well as connecting to the design platform and competence centres, among others.
News flashes
OCD Update: As standard procedure, all the Ownership Control Declarations (OCD) from all consortium members should be merged into a single PDF file and uploaded with the project proposal in the portal. In case the OCD contains sensitive data, the form can be dropped in the “Sensitive Ownership Control Declarations” corresponding Chips JU call website folder instead. To be considered valid the submission of the OCD on the Chips JU website should respect the call deadline.
Opening date: 2025-07-08 (1 year ago)
Closing date: 2025-11-20 (10 months ago)
Procedure: single-stage
Budget: 30,000,000
Expected grants: 1
Contribution: 1,000,000 - 30,000,000
This call topic has been appended 2 times by the EC with news.
-
2026-10-15
ocd update: as standard procedure, all t... -
2026-10-15
the submission session is now available...
DIGITAL-JU-CHIPS-2025-SG-SSOI
Call topics are often grouped together in a call. Sometimes this is for a thematic reason, but often it is also for practical reasons.
There are 0 other topics in this call:
Showing the latest information. Found 3 versions of this call topic in the F&T portal.
Information from
- 2025-11-21_06-20-16
- 2025-10-28_15-26-59
- 2025-07-08_03-20-09
Check the differences between the versions.
Annotations
Events
Hand-picked events relevant to this call topic.
No events yet
There are currently no events linked to this call topic.
Timeline
Grant agreement signed · 20 Jul 2026 (2 months ago)
All expected milestones for this call have passed.
Work programme published
08 Jul 2025
Call published
08 Jul 2025
Call opens
08 Jul 2025
Call closes
20 Nov 2025
Outcome expected
20 Apr 2026 · est.
Grant agreement signed
20 Jul 2026 · est.
-
Work programme published
08 Jul 2025 · 1 year ago
Topics are listed in the Work Programme before the call opens. Spotting this early gives you a head start on partner search and proposal planning.
-
Call published
08 Jul 2025 · 1 year ago
This topic was first published in TopicTree.
-
Call opens
08 Jul 2025 · 1 year ago
Submissions can be made from this date.
-
Call closes
20 Nov 2025 · 10 months ago
Deadline to submit a proposal.
-
Outcome expected Estimated
20 Apr 2026 · 5 months ago
The maximum time to inform applicants of the evaluation outcome is five months after the call closes.
-
Grant agreement signed Estimated
20 Jul 2026 · 2 months ago
The maximum time to sign the grant agreement is three months after applicants are informed of the outcome.
Funded Projects
Loading...
Project information comes from CORDIS (for Horizon 2020 and Horizon Europe) and will be sourced from F&T Portal (for Digital Europe projects)
Ecosystem bubbles
This call topic is part of the following thematic bubbles.