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DIGITAL-JU-Chips-2025-SG-LFA

Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration -

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Call text (as on F&T portal)

View on F&T portal

Expected Outcome:

This topic will open up new opportunities for European-based semiconductor packaging companies and their supply chain by building on currently available services of RTOs and all Chips JU pilot lines. The LFA projects should prepare and speed up the transfer of technologies from pilot lines to industrial deployment.

In addition, projects should expand the advanced packaging ecosystem in Europe and boost its competitiveness by offering a fast path towards industrialization of European semiconductor technology.

Through possible involvement of appropriate actors across the value chain – from materials, substrate, equipment, and test providers through packaging companies and their European customers – proposed projects should build a strong European innovation and transfer ecosystem for advanced packaging solutions, contributing to new and resilient supply chains in Europe.

News flashes

2026-04-08

IMPORTANT : NEW DEADLINE :

The Governing Board of the Chips JU has decided to postpone the closing date of the open calls on Lab-to-Fab accelerators. The new deadline is May 7th, 2026.

call topic details
Call status: Closed
Opening date: 2025-12-03 (4 months ago)
Closing date: 2026-02-25 (1 month ago)
Procedure: single-stage

Budget: 50,000,000
Expected grants: 5
Contribution: 500,000 - 15,000,000
News flashes

This call topic has been appended 1 time by the EC with news.

  • 2026-04-08
    important : new deadline :the governing...
Call

DIGITAL-JU-CHIPS-2025-SG-LFA

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Source information

Showing the latest information. Found 2 versions of this call topic in the F&T portal.

Information from

  • 2026-02-14_06-20-10
  • 2025-12-03_06-20-06

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Call topic timeline

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  1. Opening date

    - 4 months ago

    The call opened for submissions.

  2. Work programme available

    - 4 months ago

    The call topics are published first in the Work Programme, which is available a while before the call opens. By following up the Work Programme publications, you can get a headstart.

  3. Publication date

    - 4 months ago

    The call was first imported in TopicTree.

  4. Closing date

    - 1 month ago

    Deadline for submitting a project.

  5. Today

  6. Time to inform applicants Estimate

    - 3 months from now

    The maximum time to inform applicants (TTI) of the outcome of the evaluation is five months from the call closure date.

  7. Sign grant agreement Estimate

    - 6 months from now

    The maximum time to sign grant agreements (TTG) is three months from the date of informing applicants.

Funded Projects

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Project information comes from CORDIS (for Horizon 2020 and Horizon Europe) and will be sourced from F&T Portal (for Digital Europe projects)

Bubbles

This call topic is part of:

Chips

Microelectronics and Nanoelectronics

Call document info

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