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DIGITAL-JU-CHIPS-2026-SG-JAPAN

International collaboration EU and Japan on semiconductors -

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Call text (as on F&T portal)

View on F&T portal

Expected Outcome:

Projects are expected to contribute to the following expected outcomes:

  • Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.

  • Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem

Expected outcomes should have direct and immediate impact on European industry.

Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

News flashes

2026-07-30
The submission session is now available for: DIGITAL-JU-CHIPS-2026-SG-JAPAN
call topic details
Call status: Open
Opening date: 2026-07-07 (3 weeks ago)
Closing date: 2026-09-24 (1 month from now)
Procedure: single-stage

Budget: 5,000,000
Expected grants: 2
Contribution: 3,000,000 - 5,000,000
News flashes

This call topic has been appended 1 time by the EC with news.

  • 2026-07-30
    the submission session is now available...
Call

DIGITAL-JU-CHIPS-2026-SG-JAPAN

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Source information

Showing the latest information. Found 1 version of this call topic in the F&T portal.

Information from

  • 2026-07-07_06-20-13

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Call topic timeline

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  1. Opening date

    - 3 weeks ago

    The call opened for submissions.

  2. Work programme available

    - 3 weeks ago

    The call topics are published first in the Work Programme, which is available a while before the call opens. By following up the Work Programme publications, you can get a headstart.

  3. Publication date

    - 3 weeks ago

    The call was first imported in TopicTree.

  4. Today

  5. Closing date

    - 1 month from now

    Deadline for submitting a project.

  6. Time to inform applicants Estimate

    - 6 months from now

    The maximum time to inform applicants (TTI) of the outcome of the evaluation is five months from the call closure date.

  7. Sign grant agreement Estimate

    - 9 months from now

    The maximum time to sign grant agreements (TTG) is three months from the date of informing applicants.

Funded Projects

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Project information comes from CORDIS (for Horizon 2020 and Horizon Europe) and will be sourced from F&T Portal (for Digital Europe projects)

Call document info

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