HORIZON-JU-CHIPS-2026-FT2-IA
IA Resilience call reinforcing Europe's strength in photonics -
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HORIZON-JU-EUROHPC-2026-PQC-06-01
Large-Scale Photonic Quantum Computing Platform TechnologiesMOTIVATION thematic relation with quantum technologies and photonics
Call text (as on F&T portal)
View on F&T portalExpected Outcome:
Proposals submitted to this call are expected to address several of the following elements:
• Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.
• Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.
• Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches.
• Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks.
• Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.
News flashes
Opening date: 2026-07-07 (1 month ago)
Closing date: 2026-09-16 (1 month from now)
Procedure: single-stage
Budget: 20,000,000
Expected grants: 2
Contribution: 1,000,000 - 10,000,000
This call topic has been appended 1 time by the EC with news.
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2026-08-09
the submission session is now available...
HORIZON-JU-CHIPS-2026-FT2-IA
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Showing the latest information. Found 1 version of this call topic in the F&T portal.
Information from
- 2026-07-07_06-30-32
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Call topic timeline
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Work programme available
- 3 months agoThe call topics are published first in the Work Programme, which is available a while before the call opens. By following up the Work Programme publications, you can get a headstart.
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Opening date
- 1 month agoThe call opened for submissions.
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Publication date
- 1 month agoThe call was first imported in TopicTree.
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Today
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Closing date
- 1 month from nowDeadline for submitting a project.
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Time to inform applicants Estimate
- 6 months from nowThe maximum time to inform applicants (TTI) of the outcome of the evaluation is five months from the call closure date.
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Sign grant agreement Estimate
- 9 months from nowThe maximum time to sign grant agreements (TTG) is three months from the date of informing applicants.
Funded Projects
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Project information comes from CORDIS (for Horizon 2020 and Horizon Europe) and will be sourced from F&T Portal (for Digital Europe projects)
Bubbles
Chips / Micro- and Nanoelectronics
<p>This ecosystem bubble includes call topics from Horizon 2020, Horizon Europe and Digital Europe that focus on micro- and nanoelectronics. This also includes call topics from the Joint Undertakings ECSEL (H2020) and KDT / <a target="_blank" rel="noopener noreferrer nofollow" href="https://www.chips-ju.europa.eu/">Chips </a>(Horizon Europe). Also see <a target="_blank" rel="noopener noreferrer nofollow" href="https://digital-strategy.ec.europa.eu/en/policies/electronics">Electronic components and semiconductors | Shaping Europe’s digital future </a>for further policy background.</p>
Quantum Technologies
<p>Quantum technologies are funded in H2020, Horizon Europe and Digital Europe in several different areas. The Quantum Flagship initiative is a key player in this area, as are the Joint Undertakings (JUs) on Chips (Chips JU) and High Performance Computing (EuroHPC JU).</p>