IA Resilience call reinforcing Europe's strenght in power electronics
Call text (as on F&T portal)
View on F&T portalScope:
Proposals innovations should address one or more of the several domains :
- WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions.
- WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain.
- A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes.
- Next generation or optimised new power semiconductor devices fitting their application.
- Adding intelligence to power semiconductor devices on control and/or sensor side.
- Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging.
- Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide stable and clean power supply that minimises disruptions, equipment failures, and data corruption.
- Advanced characterization techniques for new materials, devices, and systems.
- Implement AI at system level and/or make use of AI methods to increase the innovation speed.
News flashes
Opening date: 2026-07-07 (3 months ago)
Closing date: 2026-09-16 (4 weeks ago)
Procedure: single-stage
Budget: 20,000,000
Expected grants: 2
Contribution: 1,000,000 - 10,000,000
This call topic has been appended 1 time by the EC with news.
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2026-10-15
the submission session is now available...
HORIZON-JU-CHIPS-2026-FT1-IA
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Timeline
Call closes · 16 Sep 2026 (4 weeks ago)
Next: Outcome expected, 4 months from now (16 Feb 2027, estimated)
Work programme published
07 May 2026 · est.
Call published
07 Jul 2026
Call opens
07 Jul 2026
Call closes
16 Sep 2026
Outcome expected
16 Feb 2027 · est.
Grant agreement signed
16 May 2027 · est.
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Work programme published Estimated
07 May 2026 · 5 months ago
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Call published
07 Jul 2026 · 3 months ago
This topic was first published in TopicTree.
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Call opens
07 Jul 2026 · 3 months ago
Submissions can be made from this date.
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Call closes
16 Sep 2026 · 4 weeks ago
Deadline to submit a proposal.
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Outcome expected Estimated
16 Feb 2027 · 4 months from now
The maximum time to inform applicants of the evaluation outcome is five months after the call closes.
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Grant agreement signed Estimated
16 May 2027 · 7 months from now
The maximum time to sign the grant agreement is three months after applicants are informed of the outcome.
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Project information comes from CORDIS (for Horizon 2020 and Horizon Europe) and will be sourced from F&T Portal (for Digital Europe projects)
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