Generic micro- and nano-electronic technologies -

Scope

Specific Challenge:

Scope: The focus will be on the grand technological challenges in information processing and communications based on memory and logic devices, circuits and architectures for advanced CMOS technologies. It will also be on the exploration of new alternative information processing devices and microarchitectures for existing or new functions. The objective is to sustain the historical integrated circuit scaling cadence and reduction of cost/function into future decades.

a.      Research & Innovation Actions

         Extending MOSFET to the end of the ITRS roadmap and making "Beyond and Extended CMOS" devices compatible with CMOS (integration, systemability and manufacturability). Focus will be on high mobility substrates for performance improvement, new switch architectures for reduced energy dissipation, 3D approaches, new information carriers, emerging memory devices and on interconnecting nanoscale objects and novel interconnect architectures. The projects may include activities related to modelling and simulation: e.g. quantum and atomic scale effects. Exploratory research on Graphene devices will be handled under the Graphene Flagship and therefore not included under this objective.

         Integration of functionalities in a system-on-chip (SoC) or system-in-package (SiP) by using nanostructures and/or nanodevices.   

         New computing paradigms like quantum computing and neuromorphic computing with a focus on their future integration with Si technologies.  

         Design for advanced nanoelectronics technologies. Focus will be on design-technology solutions for energy efficiency, high reliability and robustness.

b.      Innovation Actions targeted to provide access for academia, research institutes and SMEs to advanced design tools and IC fabrication, including access to technology platforms for piloting small series of advanced products. Actions should include training. Assessment for technology suppliers in nano-electronics to evaluate novel equipment, processes and building blocks with potential customers, including tools and methods for metrology and characterisation. This last area is open to international cooperation. 

c.       Coordination and support actions

         International cooperation with USA and Asia in the areas of standardisation including in manufacturing (450 mm wafers); improved assessment of the potential impact on workers of the manipulation of nano-materials in the semiconductor fabrication process.

         Development of common roadmaps; early technology benchmark/identification on promising novel technologies.

         Awareness actions targeted at young students.

Expected impact:

         Regain market shares of the European electronic sector and reverse the declining EU market share in electronic components. Maintain the European manufacturing base and prepare the industry for future developments of the electronic landscape.

         At the economic level, secure the availability of essential parts in the value chain in Europe to design and manufacture innovative electronic components and systems.

         At technological level, sustain the historical integrated circuit scaling cadence and reduction of cost/function and strengthen the interaction between design and technology development;   continue to increase the number of devices per mm2, with minimum features approaching 10 nanometers or per mm3 by developing 3D approaches, to maintain the industry pace of a doubling of transistor density every 18 months.

         At innovation level, facilitate the easy access to design tools and advanced IC manufacturing for academia, research institutes and SMEs, and for European equipment industry to validate their innovative equipment.

         Improved coordination in identified areas. Ensure that young people understand the fundamental nature and the importance of micro and nano-electronics technology for our future and want to work in this area.

Types of action:

a.       Research & Innovation Actions – Proposals requesting a Small contribution are expected

b.      Innovation Actions – Proposals requesting a Small contribution are expected

c.       Coordination and Support Actions

International cooperation

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